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A9108vs Semi Auto Vacuum Mounting |
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A9308vf Full Auto Vacuum Mounting |
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A9112 Semi Auto Vacuum Mounting |
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A3106 Semi Auto Ultrasonic Contactless Wafer Cleaning System |
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Auto mounting of Mylar tape over the wafer back up to the metal film frame |
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Auto circular slitting of Mylar tape over the metal film frame |
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Auto feeding of mylar tape. After full completion of tape mounted |
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Auto wind of waste Mylar tape |
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Auto vacuum level detection system. Using digital pressure sensor (Closed Loop) |
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Motorized Mylar tape tension adjustment |
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Programmable, tape wastage pitch / distance |
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Built in electronic safety (Curtain) sensor |
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STATIC elimination blower (Optional) |
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Built in shift counter (A, B ,C, & D) |
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Self-diagnostic and error code display, on electronic touch screen |
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Electronic colour touch screen display |
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No, roller used, non-contact mounting process |
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100% pure vacuum wafer mounting up to the metal film frame |
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Capable of mounting wafer size 6 & 8 inches |
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Capable of mount wafer thickness from 8 mils and above |
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Capable of handling 8 inches metal film frame |
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Capable of handling UV tape, C/W an auto inter-leave tape liner pick up system (optional) |
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Capable of handling 8 inch mylar tape |
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Conversion time for 6 to 8 inches wafer, vice versa (10 minutes) |
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Power Supply |
: 220-240Vac Single Phase |
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Air Supply |
: 70 PSI |
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Machine Weight |
: 480 Kg. Est. |
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Dimension |
: 1138(L) x 750(W) x 1720(H) mm |
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Auto mounting of Mylar tape over the wafer back up to the metal film frame |
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Auto circular slitting of Mylar tape over the metal film frame |
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Auto feeding of mylar tape. After full completion of tape mounted |
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Auto wind of waste Mylar tape |
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Auto vacuum level detection system. Using digital pressure sensor (Closed Loop) |
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Motorized Mylar tape tension adjustment |
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Programmable, tape wastage pitch / distance |
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Built in electronic safety (Curtain) sensor |
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STATIC elimination blower (Optional) |
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Built in shift counter (A, B ,C, & D) |
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Self-diagnostic and error code display, on electronic touch screen |
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Electronic colour touch screen display |
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| (Subjected to change without prior notice) |
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No, roller used, non-contact mounting process |
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100% pure vacuum wafer mounting up to the metal film frame |
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Capable of mounting wafer size 8 & 12 inches |
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Capable of mount wafer thickness from 8 mils and above |
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Capable of handling 8 / 12 inches metal film frame |
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Capable of handling UV tape, C/W an auto inter-leave tape liner pick up system (optional) |
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Capable of handling 8 and 12 inches mylar tape |
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Conversion time for 8 to 12 inches wafer, vice versa (10 minutes) |
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Power Supply |
: 220-240Vac Single Phase |
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Air Supply |
: 70 PSI |
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Machine Weight |
: 550 Kg. Est. |
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Dimension |
: 1150L) x 920(W) x 1720(H) mm |
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Fully Auto Mode / Semi Auto Mode |
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Auto loading / unloading of wafers into vacuum chamber |
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Auto mounting of Mylar tape over the wafer back up to the metal film frame |
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Auto circular slitting of Mylar tape over the metal film frame |
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Auto feeding of mylar tape. After full completion of tape mounted |
|
|
Auto wind of waste Mylar tape |
|
|
Auto vacuum level detection system. Using digital pressure sensor (Closed Loop) |
|
|
Motorized Mylar tape tension adjustment |
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|
Programmable, tape wastage pitch I distance |
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|
Built in electronic safety (Curtain) sensor |
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|
STATIC elimination blower (Optional) |
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Built in shift counter (A, B ,C, & D) |
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Self-diagnostic and error code display, on electronic touch screen |
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Electronic colour touch screen display |
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Auto de-Taper system |
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Auto UV Cure system |
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Auto Barcode label |
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OCR reader system |
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High frequency ultrasonic with sweeping modulator cleaning |
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Manual loading / unloading of wafer with frame into the input track |
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Auto detection of metal frame and wafer present |
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Auto rotation of wafer during cleaning |
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Auto spin dry of wafer water droplets |
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Auto hot air drying |
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Auto detection of water level |
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Auto draining water, after completion of wafer cleaning |
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Auto turns ON / OFF of ultrasonic generator |
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Electronic touch screen |
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| (Subjected to change without prior notice) |
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No contact cleaning |
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Capable of cleaning wafer size of 4, 5 and 6 inches wafer |
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Capable of handling 6 inches metal film frame |
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Program selection parameter for cleaning |
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Program selection for wafer drying |
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Program selection for ultrasonic agitation |
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Program selection for wafer high speed spin dry |
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Programmable user friendly, process parameter with 6 memory storage |
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Built in program for 4, 5 ,6 inches wafer |
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Built in shift counter for A,B,C,D shift |
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Power Supply |
: 220-240Vac Single Phase |
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Air Supply |
: 70 PSI |
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Machine Weight |
: 380 Kg. Est. |
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Dimension |
: 780(L) x 750(W) x 1430(H) mm |
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