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ASA prides itself in providing world-class automated backend equipment for the semiconductor assembly process.
In 2003, ASA won the Advanced Packaging Award for the Flip Chip Process under the Materials & Products category for its flip chip bonder model AFC-8000.

Advanced Packaging Award is an annual event organised by the Advanced Packaging Magazine.

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33 Ubi Ave 3 #08-69 Vertex Singapore 408868  T (65) 6512 8310  Company Registration No.: 198600740M
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