Advanced Systems Automation Limited ("ASA" or the "Group") entered the semiconductor industry in 1986. Its core business lies in manufacturing automated equipment for the encapsulation of semiconductors. Today, ASA's encapsulation equipment are used by semiconductor assembly processes around the world.
In 1997, ASA embarked into developing the worlds first total backend inline equipment solution. Thereafter, in 2000, through further development, it successfully launched the Solder Ball placement and the Saw Singulation and Sort machines. These equipment were designed for the Ball Grid Array packages, which were then experiencing rapid growth. In 2003, a high speed Flip Chip bonder was introduced to the market and this design won the Advanced Packaging Award that year.