Home Enquiries Career Opportunities Sitemap  
Company Profile
Chairman and CEO's Message
Corporate Information
Quality & Standards
History & Milestones
Whistleblower Statement


Advanced Systems Automation Limited ("ASA" or the "Group") entered the semiconductor industry in 1986. Its core business lies in manufacturing automated equipment for the encapsulation of semiconductors. Today, ASA's encapsulation equipment are used by semiconductor assembly processes around the world.

In 1997, ASA embarked into developing the worlds first total backend inline equipment solution. Thereafter, in 2000, through further development, it successfully launched the Solder Ball placement and the Saw Singulation and Sort machines. These equipment were designed for the Ball Grid Array packages, which were then experiencing rapid growth. In 2003, a high speed Flip Chip bonder was introduced to the market and this design won the Advanced Packaging Award that year.

On 16 August 2006, ASA was acquired by ASTI Holdings Limited ("ASTI") becoming a part of the latters Backend Equipment Solutions & Technologies ("BEST") business cluster. Today, the Group prides itself as a world-class manufacturer of automated backend equipment for the semiconductor assembly process. Its equipment are sold globally to major semiconductor manufacturers.

Another core business segment within ASA is its Equipment Contract Manufacturing Services ("ECMS") unit. This division manufactures electromechanical components and parts for the semiconductor, healthcare and scientific industries. In 2013, the Group expanded its competency and skillset in this business segment through the acquisition of ASA Multiplate (M) Sdn. Bhd. and Emerald Precision Engineering Sdn. Bhd.

For more information, please visit our website at www.asa.com.sg

Our Affiliates:

Back to top
33 Ubi Ave 3 #08-69 Vertex Singapore 408868  T (65) 6512 8310  Company Registration No.: 198600740M
Copyright © 2021 Advanced Systems Automation Limited. All rights reserved. Terms & Conditions of Use.