The ASA Group of Companies started as a precision engineering company manufacturing semiconductor tools and spares.
1986
ASA identified a niche in the semiconductor industry and strategically moulded its core business towards manufacturing automation equipment for the encapsulation of semiconductors.
1997
ASA developed the world's first backend inline equipment solution to its customers.
2000
ASA successfully launched the Solder Ball Placement, Saw Singulation and Sort Machines.
2003
ASA introduced a high-speed Flip Chip Bonder to the market and the Company is proud to have won the Advanced Packaging Award for this product.
2006
Microfits (Beijing) Technology was set up in China to provide ASA a cost efficient manufacturing platform, tapping on the optimal manufacturing environment in China.
ASA was acquired by ASTI Holdings Limited ("ASTI"), becoming part of the Group's Backend Equipment Solutions & Technologies ("BEST") business cluster.