Saw Singulation Sort Handler (AS108)

Key Features

Throughput up to 17,000 uph (Gross), based on QFN 3x3 mm
1170 units/strip with 5 face + Mark vision inspection
Optional 5 Face + Mark vision for package side saw quality
Flexible output – Tray, Tube, Canister
Fast Conversion of less than 15 minutes with minimum part change
No Flip required on Output Tray; Dual Good Tray Stack
 
 
Technical Specifications
(Subjected to change without prior notice)
 
Substrate Size Length: 250mm (max), Width: 70mm (max)
Package Type QFN and BGA
Package Size Capability 3 x 3 mm – 12 x 12 mm for QFN
3 x 3 mm – 17 x 17 mm for BGA
Max Panel Warpage Allowed BGA - 0.7 mm max (Mold Area 51 mm x 51 mm)
QFN - 0.5 mm max (Mold Area 51 mm x 51 mm)
(Subject to change according to substrate thickness and design)
Max. Strip Warpage Approximately 2 mm
Slot Magazine Capability Length 275 (max), Width 80mm (max), Height 160mm (max)
Magazine Buffer 400mm (min. 5 magazines)
Vision Inspection (BGA) Missing Ball, Extra Ball, Ball Size, Ball Position, Ball Offset, Package Offset and Package Dimensions
Vision Inspection (QFN) Package Dimensions, Package Offset, XY Burr Size, Solder Bridging, Smearing, Flashes on Lead and Mold Chipping
MTBA > 4 Hrs
MTBF > 168 Hrs
Machine Uptime > 98%
Network Capability SECS I/II, GEM (Optional)
Conversion Time  < 15 minutes (For family type)
Footprint 3370 (L) x 1540 (W) x 1850 (H) (Including Saw Engine)
Weight 2600kg (Exclude dicing saw), 4470kg (With dicing saw)
Electrical Power (Typical) 415 VAC, 3 phase, 8KVA, 50/60 Hz
Compressed Air Supply 6 bar, Flow rate: 800 l/min (2 Inlets)
Water Consumption 3 bar – 5 bar, Flow rate: 3 l/min
 

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