• Especially ideal for flipchip on leadframes - up to 8000 UPH • +/- 15 microns at 3σ capability • Turret Mechanism (Patented), enabling concurrent process • Small die handling  - 0.5 x 0.5 mm • P-coat application  (concurrent flux punch) • "Look Up, Look Down" vision alignment • Post placement vision check • Bump inspect before bond • In-line link to reflow & molding system • Large Panel Handling  (320mm x 100mm) • Precision bond force control • Fast Conversion

• SBP (Solder Ball Placement) is equipped with the flexibility to attach solder balls on PBGA, singulated BGA and array BGA packages • Capable of handling solder ball size of 0.2mm at 0.4m pitch • Substrate vision alignment system • Proprietary positive ball handling mechanism • Vision inspection to check for missing/ double/ offset/ oversize/ undersize solder balls • P-Coat application

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