Advanced Systems Automation Limited (“ASA” or the “Group”) entered the semiconductor industry in 1986. Its core business lies in manufacturing automated equipment for the encapsulation of semiconductors. Today, ASA’s encapsulation equipment are used by semiconductor assembly processes around the world.

In 1997, ASA embarked into developing the world’s first total backend inline equipment solution. Thereafter, in year 2000, through further development, it successfully launched the Solder Ball placement and the Saw Singulation and Sort machines. These equipment were designed for the Ball Grid Array packages, which were then experiencing rapid growth. In 2003, a high speed Flip Chip bonder was introduced to the market and this design won the Advanced Packaging Award that year.

Today, the Group prides itself as a world-class manufacturer of automated backend equipment for the semiconductor assembly process. Its equipment are sold globally to major semiconductor manufacturers. Another core business segment within ASA is its Equipment Contract Manufacturing Services (“ECMS”) unit. This division manufactures electromechanical components and parts for the semiconductor, healthcare and scientific industries.

On 16 August 2006, ASA was acquired by ASTI Holdings Limited (“ASTI”) becoming a part of the latter’s Backend Equipment Solutions & Technologies (“BEST”) business cluster. The ASTI Group provides an integrated range of services comprising “BEST”, Precision Engineering and Distribution & Services. With its wide spectrum of expertise and synergistic collaboration with ASTI, ASA is wellpositioned to offer the semiconductor industry with innovative total solutions in the backend semiconductor assembly process.