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Capable of separating the kapton tape from the substrate without any manual handling |
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Fully automatic system |
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PLC based control |
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Robotic transfer mechanism |
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Compact |
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Small footprint system with the capability of mounting wafer and substrate onto the frame |
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High throughput |
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System designed with motorized handling mechanism provides the shortest possible handling time |
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High quality and performance |
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Uniform controlled motion ensures the consistence quality mount |
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User-friendly electronic touch panel |
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Interactive navigate screen |
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Excellent access window |
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Self-diagnosis functions with error code display |
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Semi-Auto mounting the Mylar tape onto the backside of the LED substrate 100mm x 100mm or 8 inch Silicon wafer |
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Designed to apply the adhesive tape to the substrate and frame and then cut
the applied adhesive tape along the frame without making any disturbance or
damage to the wafer |
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The adhesive tape winding-up automatically after every mounting, and the
cut tape rolls on the tape un-reel feeder |
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Power Supply |
: 220 - 240 Vac Single Phase |
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Ampere |
: 15 Amp |
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Air Supply |
: 70 to 80 PSI |
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Machine Weight |
: 350 Kg. Est. |
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Dimension |
: 820(L) x 620(W) x 1580(H) mm |
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