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A2108 Solder Ball Placement SBP 9300
Flip Chip Bonder AFC 8000  
 
A2108
Features
High Intensity flash UV
No Nitrogen gas required
Single frame or cassette loading
High throughput
high quality and performance
Choices of UV Irradiation: 6" and 8" Wafer / Frame Curing
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Flip Chip Bonder AFC 8000
Features
Especially ideal for flipchip on leadframes - up to 8000 UPH
+/- 15 microns at 3s capability
Turret Mechanism (Patented), enabling concurrent process
Small die handling - 0.5 x 0.5 mm
P-coat application (concurrent flux punch)
"Look Up, Look Down" vision alignment
Post placement vision check
Bump inspect before bond
In-line link to reflow & molding system
Large Panel Handling (320mm x 100mm)
Precision bond force control
Fast Conversion
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Solder Ball Placement SBP 9300
Features
SBP (Solder Ball Placement) is equipped with the flexibility to attach solder balls on PBGA, singulated BGA and array BGA packages
Capable of handling solder ball size of 0.2mm at 0.4m pitch
Substrate vision alignment system
Proprietary positive ball handling mechanism
Vision inspection to check for missing/ double/ offset/ oversize/ undersize solder balls
P-Coat application

Our Affiliates:

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Blk 25 Kallang Avenue #03-01 Kallang Basin Industrial Estate Singapore 339416T (65) 6309 5500F (65) 6292 5636Company Registration No.: 198600740M
 
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