|
|
|
|
Especially
ideal for flipchip on leadframes - up to 8000 UPH |
|
|
+/- 15
microns at 3s capability |
|
|
Turret
Mechanism (Patented), enabling concurrent process |
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|
Small
die handling - 0.5 x 0.5 mm |
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|
P-coat
application (concurrent flux punch) |
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"Look
Up, Look Down" vision alignment |
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Post placement
vision check |
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Bump inspect
before bond |
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In-line
link to reflow & molding system |
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Large Panel
Handling (320mm x 100mm) |
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Precision
bond force control |
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Fast Conversion |